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Product Spotlight
June 23, 2020
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IP67/68 rated I/O connectors

Samtec ACCLIMATE™ Sealed I/O Connectors are IP67/68 dust and water protected and are ideal for high-reliability in rugged applications. These sealed systems include bayonet circulars in 12mm, 16mm, and 22mm shell sizes, sealed rectangulars, as well as Ethernet and USB signal assemblies. Dust caps are available for all sizes.

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High-reliability MCUs with large memory capacities for industrial equipment

Renesas Electronics RX72N Microcontrollers (MCUs) feature 32bit RXv3 CPU core, 1MB SRAM, up to 4MB flash memory, and achieves superior performance with 1396 CoreMark capability at 240MHz operating frequency-range. RX72N MCUs offer unique cryptographic-key protection and hardware cryptography accelerators supporting ECC and RSA. The low-power design and architecture of these devices support a single voltage supply ranging from 2.7V to 3.6V. The various communication interfaces include Ethernet MAC compliant with IEEE 1588, SD host interface, quad SPI, and CAN.

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AEC-Q200 qualified, high-power density, metal plate shunt resistors

Vishay/Dale WFPx3939 Automotive Grade Power Metal Plate Shunt Resistors feature a 20W power rating in a 3939-size package with Kelvin terminals. These devices enable the use of a single high-power resistor in place of multiple low-power devices in parallel. This reduces measurement errors and board space requirements while enabling the design of smaller and lighter end products.

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5G wireless infrastructure solutions

Amphenol RF 5G Wireless Connectors, adapters, and cable assemblies ensure high data rates for low-latency applications. These devices are high-density, cost-effective, and robust products that enable and enhance wireless infrastructure evolution. Amphenol RF offers low PIM products, including HD-EFI, N-Type, PSMP, SMP, SMPM, 2.2/5, 4.3/10, and 7/16 connector series, as well as cable assemblies and adapters.

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High-speed circuit protection with longevity

Littelfuse QS Series High-Speed Round Body Fuses offer extreme current limiting protection against power surges as well as balanced performance for longevity. L50QS and L70QS series high-speed fuses use arc-quenching stone sand to provide lower arc voltages, while offering reduced l2t let-through energy and peak currents. Universal mount bolted-end terminals give these RoHS and REACH compliant fuses the ability to easily replace existing fuses in the field.

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Highly integrated, non-isolated DC/DC converter

Texas Instruments TPS546D24A SWIFT™ Synchronous Buck Converter is capable of high-frequency operation and 40A current output from a 7mm×5mm package. Two, three, and four TPS546D24A devices can be interconnected to provide up to 160A on a single output. The device has an option to overdrive the internal 5V LDO with an external 5V supply via the VDD5 pin to improve efficiency and reduce the power dissipation of the converter.

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Fully-Programmable Alternative for Traditional ASIC and SoC Users

Xilinx Zynq®-7000 SoCs allow a flexible platform to launch new solutions and are available in dual-core and single-core Cortex-A9 configurations. The ARM® Cortex™-A9 processors present an integrated, performance-per-watt 28nm programmable logic that achieves power and performance levels exceeding that of discrete processor and FPGA systems. These features make the Zynq-7000 SoCs the best option for a wide range of embedded applications, including small cell base stations, multicamera drivers assistance systems, machine vision for industrial automation, medical endoscopy, and 4K2K Ultra-HDTV.

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High-resolution 32-bit 192kHz audio processing capable SoC

ON Semiconductor LC823455 Audio Processing System-on-Chip (SoC) features a Dual CPU configuration and a DSP providing intensive processing capability, 4316KB of internal SRAM that supports the implementation of large-scale programs for WLAN applications, and multiple interfaces for increased extensibility. This SoC features an extensive range of functions including SBC/AAC codec and Active Noise Canceller by the DSP, UART, and ASRC. The highly integrated implementation of this rich set of audio functions results in a miniature footprint with ultra-low power consumption.


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Electronic Design
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