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Electronic Design Today
March 8, 2021
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TechXchange: Chip Packaging

Packaging: The new dimension of advancement in the semiconductor industry.

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One of the last in-person events in 2020 was Embedded World. This year it will be an online conference.

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The expression “Nobody said this would be easy” certainly applies to developing complex electronic systems. IPS President Mitch Maiman presents the five main challenges faced by designers to meet today’s demands.

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