Electronic Design Power & Analog Update  |   To view this email as a web page, click here.
 
 
Electronic Design Power & Analog Update
April 27, 2022

Featured Articles

 
11myths Promo

11 Myths About Low-Value Shunt SMD Resistors

Challenges often arise with the relatively common low-ohmic-value resistors during the design and manufacturing phases, leading to an array of misconceptions about them. This article sets about to debunk those myths.

 
 

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1650659390 Value Power Modules 640x360
 

In this training series, we discuss the high level of integration of DC/DC power modules and the significant implications that this has on power supply design. In addition to high power density and small solution size, modules can also simplify EMI mitigation and reduce power supply design time. And thanks to improved process and packaging technology, a power module may even provide all of these benefits with a lower overall solution cost as well.

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The TLVM13630 36-V, 3-A integrated-inductor buck module delivers ease of use with best-in-class solution size, all for a 1ku web price starting at just $1.75.

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Enhanced efficiency, reduced size

With 4-μA IQ, low RDS(ON) FETs, and a 3-mm x 2.8-mm MicroSiP™ package, the 17-V, 3-A TPSM82903 buck module is your new go-to IC for point-of-load power supply applications.

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Related Content

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1650899227 Acheiving High Thermal Performance
 

An integrated inductor and minimum solution size doesn’t necessarily require a compromise with respect to thermal performance. Learn why in this application brief.    


 
1650899227 Innovative Dcdc Power Modules
 

Get an overview of the most diverse portfolio of DC/DC power modules in the industry. Use the guide to learn about all the latest and best TI power modules and to find the one that is best for your next design.


 
1650899226 Micro Si P Power Modules
 

TI’s MicroSiP packaging provides maximum integration and minimum solution size. In the paper, we take a deep dive into manufacturing considerations with the MicroSiP package, including guidelines for layout, assembly, and rework.

Sponsored by Texas Instruments
 
 

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