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Electronic Design Power & Analog Update



Sponsored by Texas Instruments

Do more with less power

Our insatiable appetite for electricity brings challenges to pack more power in smaller spaces, all while reducing cost. Learn how we’re pushing the limits of power density to make your systems more efficient, reliable and affordable.

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Texas Instruments Power Density 300x250 Ed 120320 Kmr


Texas Instruments Lmg3422 R030 315x180 Ed 120320 Kmr

The new 30-mΩ 600-V GaN FET is a single-chip solution with the fastest integrated gate driver and self-protection for applications ranging from sub-100 W to 10 kW and backed by 40 million hours of device reliability testing.        

Texas Instruments Tps543620 315x180 Ed 120320 Kmr

The most efficient 12-VIN, 6-A buck converter in the industry

The TPS543620 SWIFT™ step-down converter provides the industry’s best efficiency for applications with 12-V input voltage and 6-A output current, courtesy of 25mW/6.5mW integrated FETs.

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Texas Instruments Bq25790 315x180 Ed 120320 Kmr

5-A, 1-4 cell buck-boost charger with dual-input selector and USB PD output

Industry’s first fully Integrated buck-boost battery charger to integrate switching MOSFETs, battery FET, current sensing circuits and dual-input selector to reduce solution size and BOM cost, providing 50% greater power density. 

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Power density: Increased thermal performance

Watch this short video on increasing thermal performance in your design. We’ll cover the sources of increasing temperatures in systems to the various ways to improve thermal resistance and performance, including PCB design and package technologies.

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Power density: Reduced switch losses

Watch this video on reducing switch losses for higher power density. You’ll learn about the primary limitations and how to overcome these converter power losses including conduction, charge-related, reverse-recovery, and turn-on and -off losses.

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Power density: Topology, control and circuit design

Watch this video to learn more about control methods, circuit implementations and topologies as they relate to improving and optimizing the efficiency of a power converter.

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Power density: Integration

Watch this video to learn more about the various integration technologies such as GaN FETs, power modules and isolated bias supplies that help increase performance while reducing your board area and BOM, parasitics and design time.

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The Enhanced HotRod™ QFN package technology from Texas Instruments enables engineers to address efficiency, size, and thermal challenges with an easy-to-use footprint that resembles a standard QFN. 


Maximizing the Performance of GaN with Ideal Diode Mode

The ideal diode mode enables an adaptive dead time, and automatically realizes a fast synchronous FET operation with no external circuitry or control. Learn more about the ideal diode mode feature and its benefits with experimental results.

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Smaller, faster, fewer components: USB Type-C with Power delivery

This quick read explains 3 unique ways the TPS25750 and BQ25792 devices are making it easier for designers to achieve best-in-class power density for USB PD battery charging applications.

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