Electronic Design Power & Analog Update  |   To view this email as a web page, click here.
 
Sep
29

Electronic Design Power & Analog Update

SPECIAL EDITION

 
 

Sponsored by Texas Instruments
 

Features

Quiescent current is obviously a major consideration of automotive power supply design. But have you ever been confused by all the various terms used to describe quiescent current?

 

Products

 
Tesxas Instruments Buck Converter 1 315x180 Ed 092920 Kmr
 

 
Texas Instruments Rpe9 2 Ed 315x180 092920 Kmr

Automotive 3-V to 65-V, 0.6-A buck converter optimized for size and light load efficiency 

The LMR36506-Q1 does it all for your wide VIN automotive power supply design: low EMI, 4-µA IQ, and a tiny 2-mm x 2-mm HotRod™ QFN package.

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Texas Instruments Tech Chipshot 3 315x180 Ed 092920 Kmr

2.7-V to 6-V, 2-A automotive step-down converter in SOT583 package

If you’re looking to minimize power supply size, you won’t find a smaller 2-A buck converter for automotive applications than the 1.6-mm x 2.1mm TPS628502-Q1. 

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Videos

 

Selecting Wide VIN DC/DC Converters for Commercial Vehicle Telematics

Get an overview of the power supply requirements of telematics systems in nominal 24-V commercial vehicles and Texas Instruments' latest 60-V DC-DC converter capable of supplying up to 5 A.

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Managing thermals with a 2-layer board

Conventional wisdom says that managing automotive switching regulator thermals cannot be done well on a 2-layer PCB. Watch the video to see how we are bucking that trend (pun intended).

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Whitepapers

 

Advanced EMI mitigation techniques for automotive converters

Learn more about filter design, spread spectrum, and pinout optimization to help combat the impact of automotive switching regulator EMI.

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How device-level features and package options can help minimize EMI in automotive designs

The easiest way to optimize input capacitor placement for EMI is to choose a buck converter that has the capacitor integrated into the IC. Read more about integrated caps, spread spectrum, and other mitigation techniques that you can now find inside the IC.

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