Electronic Design Power & Analog Update  |   To view this email as a web page, click here.
 
Sep
15

Electronic Design Power & Analog Update

SPECIAL EDITION

 
 

Sponsored by Texas Instruments
 
 

Understanding the trade-offs and technologies to increase power density

What are your design challenges related to power density? Improving thermals? Reducing the size of passives? In this white paper, we’ll examine the barriers and the trade-offs, and provide technology and product examples to help you overcome them.

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1599842033 Texas Instruments More Power 300x250 Ed 091520 Kmr
 

Products

 
1599842033 Texas Instruments Tpsm53604 315x180 Ed 091520 Kmr
 

By leveraging the Enhanced HotRod™ QFN technology, this device offers improved EMI and thermal performance with a footprint that is 30% smaller than anything on the market.

 
1599842033 Texas Instruments Ucc12050 315x180 Ed 091520 Kmr

UCC12050: 500-mW, high-efficiency, 5-kVRMS isolated DC/DC converter

This new IC-sized, surface-mounted bias power supply gives you an easy-to-use solution with low height, reduced BOM and improved temperature performance. The EMI-optimized transformer and quiet control scheme streamline EMI compliance with reinforced isolation.

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1599842033 Texas Instruments Tps55288 Ed 091520 Kmr

TPS55288: 36-V, 16-A buck-boost converter with PPS control

This new synchronous buck-boost converter supports an input voltage of up to 36 V and integrates two 16-A MOSFETs of the boost leg to balance the solution size and efficiency for USB Power Delivery (PD) applications.

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Videos

 

Understanding power density – increased thermal performance

Watch this short video on increasing thermal performance in your design. We’ll cover the sources of increasing temperatures in systems to the various ways to improve thermal resistance and performance, including PCB design and package technologies.

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Understanding power density – reduced switch losses

Watch this video on reducing switch losses for higher power density. You’ll learn about the primary limitations and how to overcome these converter power losses including conduction, charge-related, reverse-recovery, and turn-on and -off losses.

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Understanding power density – topology, control and circuit design

Watch this video to learn more about control methods, circuit implementations and topologies as they relate to improving and optimizing the efficiency of a power converter.

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Understanding power density – integration

Watch this video to learn more about the various integration technologies such as GaN FETs, power modules and isolated bias supplies that help increase performance while reducing your board area and BOM, parasitics and design time.

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Whitepapers

In this white paper, learn more about the landscape of isolated DC/DC bias power supplies, requirements, topologies and options to move signals and power across an isolation barrier.

 
 

Combining buck-boost and USB Type-C® PD for maximum power density

This paper examines the benefits of combining USB Type-C® Power Delivery and fully integrated buck-boost charger to provide a fast charging solution with high power density for portable electronic designs.

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Enhanced HotRod™ QFN package delivers industry-smallest size with low EMI

The noise benefits of flipped-chip-on-leadframe, with the thermal advantages of a large die attach pad. This is now possible with our new Enhanced HotRod QFN package, and it helps to make LM60440 the industry’s smallest 36-V, 4-A buck converter.

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