Analog & Power Source  |   To view this email as a web page, click here.
 
 
Analog & Power Source
March 31, 2022
 
 
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Power Density in 3D Power Packaging

Power-supply designers are more frequently being tasked to deliver higher power in the same footprint they had in their last design. 3D packaging will help make this goal a reality.

 
 
 
Intel Mask Operation

To help build a pipeline of new electrical engineers and semiconductor technicians, Intel is investing $100 million in new education and research opportunities in the U.S.

 
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